2018 TransPack Forum Call For SpeakersSpeaking at ISTA’s TransPack Forum is a powerful opportunity to share your knowledge and inspire others. You’ll receive industry recognition and network with experts and thought leaders from around the world.
ISTA is interested in abstracts on the following topics:
• Packaging Performance Testing Applications and Research
• Challenges of Protective Package Design
• Quality Assurance and Validation Best Practices
• Damage Reduction Success Stories
• e-Commerce Packaging
• Sustainable Packaging Development
• Optimization of Packaging Systems Case Studies
• Innovative Cold Chain Packaging Solutions
If you have an interesting topic or case study to contribute to our program, please submit your abstract for consideration.