December 2018
News and updates for our packaging community

ISTA Distribution Environment Data Collection Program



ISTA’s mission to empower the people and organizations affecting packaging to minimize product damage throughout distribution and optimize resource usage through effective package design continues to be greatly influenced by packaged-product performance testing.  As part of our strategic plan to deliver on this mission, ISTA is in process of developing a new “Distribution Environment Data Collection Program” with the primary goal of expanding our distribution environment data resources.  This data will then be leveraged to improve current testing protocols, add new testing protocols, and create a world-class data repository that can be leveraged by ISTA, and its members, to better model distribution locally, nationally, and internationally.  

Through both directly-funded research and industry collaboration, we’ve set a goal to obtain atmospheric, vibration, storage, and handling data that meets our established Data Collection Standards for five prioritized global distribution routes.  This data will then be developed and implemented into ISTA test procedures as deemed appropriate by the ISTA Testing Council and Technical Division Board.   

We are also interested in working with members of the community who own data for routes outside of these identified target areas and have interest in sharing and building the ISTA data repository.  This will ultimately serve to improve testing and package design globally.  

We are excited for this opportunity to collaborate with the ISTA community to continue pushing package performance testing and design forward.  Contact ISTA VP of Research and Education, Brian O'Banion (bobanion@ista.org) , directly with any questions or to note interest in participation.  
 




We are pleased to be hosting the 2019 ISTA Forum next May 13-16 in the Mile-High City – Denver, Colorado – at the brand-new Gaylord Rockies Resort & Convention Center.  We've added speakers to the program and registration is open! Keep checking back as we continue to add speakers to the program. Certified Packaging Laboratory (CPLP) and Responsible Packaging by Design (RPbD) Training and Certification will be offered prior to the Forum on May 12th and 13th.

ISTA's Forum brings together the packaging community through two co-located events, TransPack and TempPack. TransPack provides a balance of valuable presentations, case studies, research and solutions from world-leading experts surrounding the optimization of packaging for transport.  TempPack focuses on technical topics related to global temperature controlled performance packaging. The TempPack event creates an opportunity for presenters to share their insights, challenges, case studies and research having a direct impact on the industry.  Both events are designed to create opportunities for you to network with like-minded professionals who are facing the same challenges in all different sectors and verticals.




ISTA’s e-newsletter, InTouch is delivered to members and non-members around the world and features the latest news from ISTA Headquarters including upcoming events and any industry trends and insights. Our new e-newsletter replaces the digital publication, ista views – you can expect the same extensive content, just now delivered to you more frequently and in a user-friendly format. InTouch is a great place to advertise your product and services and deliver your message to 8,000+ contacts. Please contact ISTA at ista@ista.org to reserve your advertising opportunity.

Inside ISTA Headquarters

Announcing ISTA TOUCHPOINTS, E-retailer Fulfillment Publication
ISTA is pleased to announce TOUCHPOINTS - E-retailer Fulfillment, a resource providing a look into the e-commerce retailer supply chain environment to gain additional insight into handling practices and utilized materials.
 

Seeking Bids on Research Project
ISTA is now seeking bids on the following research project: Eliminate Over-Packaging.
 

Welcome to Our Newest Members!
ISTA is happy to announce the following new members have joined our community the month of October and November!
 

Congratulations CPLP and RPbD Recipients
Congratulations to all of the individuals who have achieved CPLP and RPbD certification status!
 

Announcing ISTA Distribution Environment Data Collection Program
ISTA’s mission to empower the people and organizations affecting packaging to minimize product damage throughout distribution and optimize resource usage through effective package design continues to be greatly influenced by packaged-product performance testing.
 

New Industry Job Postings Added to ISTA's Career Center
ISTA’s Career Center is a great resource to post and find a job within the packaging community. We've recently added an industry job that may be of interest.
 

Comparison of Vibration Simulation Methods (SDoF vs MDoF) on Light Weighted Distribution Packaging
The following technical paper was presented at ISTA's 2018 Forum held in San Digeo, California.
 

Seeking Workgroup Participants: Test Protocol Development
ISTA has received a request for the creation of a test method(s).
 

Seeking Workgroup Participants: 3H Test Protocol Maintenance
ISTA has received a request for maintenance to test method ISTA 3H.


Seeking Bids on Research Project
RFP-0006 Single Parcel Shipping Environment


Announcing ISTA's InTouch Online Community!
We are pleased to introduce ISTA’s InTouch Online Community!

Upcoming Events

Developing Climatic OQ Thermal Challenge Profiles Webinar
1/16/2019

 

ISTA European Packaging Symposium
3/5/2019 - 3/7/2019
Amsterdam, Netherlands | Amsterdam Marriott Hotel

 

ISTA Forum | TransPack & TempPack
5/13/2019 - 5/16/2019
Denver, Colorado | Gaylord Rockies Resort & Convention Center

 

ISTA China Packaging Symposium
9/18/2019- 0/19/2019
Shenzhen, China | Vienna Hotel Shenzhen

 

ISTA Asia Pacific Packaging Symposium
October 2019 | Philippines

ISTA intouch E-Newsletter - December 2018