Call for Speakers is Open!

Don't miss this chance to showcase your experience, knowledge and insights in the packaging industry by becoming an ISTA Forum speaker! Submit an abstract today and be a driving force in transforming the future of transport packaging.

Abstracts must be submitted by using the following online submit an abstract button, and must include abstract title, topic description, and any practical takeaways. If selected to be a speaker, your attendee registration will be waived.

Submit an Abstract!

TransPack provides a balance of valuable presentations, case studies, research and solutions surrounding the optimization of packaging for transport. Target topics of interest include:

• Packaging Performance Testing Applications and Research
  
• Challenges of Protective Package Design
  
• Quality Assurance and Validation Best Practices
  
• Damage Reduction Success Stories
  
• e-Commerce Packaging
  
• Sustainable Packaging Development
  
• Optimization of Packaging Systems Case Studies
  

TempPack focuses on technical topics related to global temperature controlled performance packaging. Target topics of interest include:

• Frozen Shipment Best Practices and Case Studies
  
• Real-Time Monitoring & Monitor Qualification
  
• Sustainability Case Studies of Re-Use vs. Single Use
  
• New Methods for Protecting High Value Product in the Supply Chain
  
• Use of the Internet of Things (IoT) for Gathering or Acting on Temperature Data Within a Supply Chain
  
• Innovative Cold Chain Packaging Solutions