 June 2024 News and updates for our packaging community. | |||||
 We're thrilled to present the 10th edition of the ISTA European Packaging Symposium to be held 08-09 October at the Le Méridien Frankfurt in Frankfurt, Germany! The 2024 program will provide insights on today's hot topics and will offer new solutions to help shape the future of transport packaging.  We're looking for thought leaders for both the general track and the temperature-sensitive track. If you are interested in pushing the packaging industry forward, we want to hear from you! Submit an abstract to share your insights, expertise, experience and shape the future of transport packaging. Deadline to submit is Monday 1 July!
The ISTA European Packaging Symposium brings together hundreds of packaging professionals. Connect with our global transport packaging community as an industry leader and become a sponsor of this year's event! 
 The 2024 ISTA China Packaging Symposium will be held on September 5-6 at the Wyndham Shanghai Nanxiang in Shanghai, China. The Symposium is hosted by International Safe Transit Association China Division and presented by China Packaging Research & Test Center and China Packaging Research Institute. Call for Speakers: Join us as a speaker at the 2024 ISTA China Packaging and enjoy exclusive benefits.  Call for Undergraduate Research Proposals from European Universities! ISTA is thrilled to announce that we are now accepting proposals for undergraduate research in transit packaging from European universities. ISTA will award two (2) grants of €4,000 each for research, with results to be reported at the 2025 ISTA European Packaging Symposium. Researchers are encouraged to submit proposals on transit packaging. The deadline to submit proposals is 1 September 2024.
 The ISTA Educational Foundation (ISTAEF) announced Sheppard Fidler as the recipient of this year’s R. David LeButt Award, which honors packaging professionals for their outstanding contributions to education in transport packaging. Sheppard Fidler was recognized at the 2024 ISTA Forum, including TempPack and TransPack events, which was held April 22 - 24 at the Marriott Marquis in San Diego, California. 
 Looking to earn ISTA PDP recertification points? You can now earn recertification points by viewing On-Demand Videos from ISTA events you missed, available on ISTA’s Online Learning Platform. Plus, points for attending an ISTA Forum or Symposium have increased to 15 per event. Keep learning and stay certified with these new opportunities!  ICYMI: The ISTA Pharma Committee released a new whitepaper "ISTA PCW-03 | Thermal Modeling/Simulation Whitepaper". The ISTA Pharma Committee and Thermal Modeling/Simulation Working Group have prepared this white paper to provide an awareness of the tools that are currently available for performing thermal modeling/simulation and to discuss the use cases that these tools are currently used for. The white paper concludes with how thermal modeling/simulation could be used within the temperature-controlled supply-chain in the future.
| |||||
| ISTA InTouch E-Newsletter - June 2024 | |||||
Target topics of interest: Retail, Logistics, Packaging Trends | Packaging Performance Testing Applications & Research | Artificial Intelligence (AI) and Machine Learning in Packaging | Quality Assurance & Validation Best Practices | Damage Reduction Success Stories | e-Commerce Packaging | Sustainable Packaging Development | Optimization of Packaging Systems and more.
