ISTA Forum Call for Speakers | TransPack and TempPack



ISTA's Forum brings together the packaging community through two co-located events, TransPack and TempPackTransPack provides a balance of valuable presentations, case studies, research, and solutions from world-leading experts surrounding the optimization of packaging for transport.  TempPack focuses on technical topics related to global temperature-controlled performance packaging.  Both events offer presenters the opportunity to share their insights, challenges, case studies and research having a direct impact on the industry. ISTA's Forum will be held May 13-16, 2019 in Denver, Colorado at the brand-new Gaylord Rockies Resort & Convention Center!
CALL FOR SPEAKERS: If you are interested in speaking at the ISTA Forum and have an informative topic or case study for either the TransPack or TempPack program, we’d like to hear from you. ISTA is interested in topics related to but not necessarily limited to the following for our programs:

  • Packaging Performance Testing Applications and Research
  • Challenges of Protective Package Design
  • Quality Assurance and Validation Best Practices
  • Damage Reduction Success Stories
  • e-Commerce Packaging
  • Sustainable Packaging Development
  • Optimization of Packaging Systems Case Studies
 
  • Case Studies on gathering Lane Data (temperature, shock, vibration)
  • New Methods for Protecting High Value Product in the Supply Chain
  • Unique Algorithms that Simplify Supply Chain Decision Making
  • Unique Design and Distribution Challenges Posed from Large Molecule Protein Solutions
  • Use of the Internet of Things (IoT) for gathering or acting on temperature data within a supply chain.
  • Simulation Applications as a Tool for Reducing Laboratory Studies
  • Innovative Cold Chain Packaging Solutions

To submit an abstract for either program, please CLICK HERE