Congratulations to the three $4,500 undergraduate research grant awardees!
The ISTA Educational Foundation has selected the following three undergraduate research proposals for the 2025-2026 grants:
- University of Florida
- Rochester Institute of Technology
- Michigan State University
These projects focus on minimizing product damage during distribution and optimizing resource usage through effective package design. The universities have been invited to present their research findings at the 2026 ISTA Forum USA, which will be held April 7-9 in Phoenix, Arizona. Research proposals accepted include:
"We're proud to support the next generation of packaging leaders," said ISTAEF Vice President & Secretary Brian O‘Banion. "We look forward to hearing from the awardees at the annual ISTA Forum USA event and are excited to support young talent and new research in our field."
Previous Award Recipients
Evaluating Sustainable Materials for Transport of Live Ornamental Fish in Insulated Shipping Containers: This study aims to evaluate alternative materials to EPS for the distribution and transport of ornamental fish, ensuring the ability of the industry to comply with existing and future restrictions while maintaining the standards of current shipping practices.
William Pelletier, Instructional Associate Professor at University of Florida
Development and Evaluation of a Simplified Multi-axis Vibration Test Apparatus: This project aims to develop a simplified, cost-effective 2-degree-of-freedom (2DOF) vibration test apparatus that induces rotational motion while mounted on a standard vertical-only Lansmont vibration table. The system will use a pivot-spine structure with elastomeric or spring components of varying stiffness (k) to enable off-vertical axis movement. The research will assess the apparatus’s ability to simulate transport-induced motions using both field and lab evaluations.
Kyle Dunno, Department Chair and Associate Professor at Rochester Institute of Technology
Enhancing Sentiment Analysis and Deep Learning for Packaging Damage Detection in DistributionThis project seeks to bridge the gap between consumer insights and packaging innovation. The enhanced AI framework will provide more precise identification of packaging failure points related to distribution, a deeper understanding of consumer interactions with packaging, a refined sentiment analysis model capable of detecting nuanced consumer emotions, and a scalable AI approach that integrates text and image-based data for a holistic evaluation of packaging performance. The project builds upon the 2024 Forum presentation but introduces significant advancements. While the earlier work focused primarily on sentiment analysis of Amazon reviews to highlight packaging issues, this new phase incorporates deep learning for image-based damage detection and emotion-aware sentiment analysis. These enhancements will allow for a more robust, multi-dimensional evaluation of packaging performance during distribution, using both text and image data from consumer feedback.
Euihark Lee, PhD. Assistant Professor at Michigan State University
ISTAEF Fundraising Event
The ISTA Educational Foundation (ISTAEF) holds a special fundraising event each year at the ISTA Forum USA, bringing together industry professionals to support undergraduate research and scholarships in transport packaging.
The next fundraising event will take place on Tuesday, April 7, 2026, at the ISTA Forum USA in Phoenix, Arizona. Mark your calendars and join us for a great opportunity to network, reconnect with friends, and contribute to raising funds for undergraduate research grants and scholarships. Your support will encourage research in undergraduate transport packaging and inspire the next wave of packaging industry leaders!
Stay tuned—registration will be available soon!
Sponsor the Fundraising Event
Helping ISTAEF cover the costs of the dinner allows the Foundation to focus more funds on our commitment to undergraduate research grants, offering innovative opportunities for budding researchers to explore and pioneer in our field.
Contact us if you are interested in becoming a Sponsor!
- Elevated Brand Exposure: Gain visibility with your logo featured across all event marketing materials, including social media promotions, press releases, and on-site signage.
- Exclusive Networking Opportunities: Every sponsor receives 5 complimentary registrations for the dinner. Bring colleagues, guests, customers, or anyone of your choosing to engage with a diverse audience comprising students, educators, industry professionals, thought leaders, and community stakeholders—expanding your network and forging invaluable connections.
- Support for Undergraduate Research Grants: Your sponsorship directly impacts our ability to provide more funding for our commitment to undergraduate research grants, offering innovative opportunities for budding researchers to explore and pioneer in our field.
Call for Undergraduate Research Proposals
Researchers are encouraged to submit proposals in transit packaging. While original concepts are welcomed and encouraged, research in the following topics would be of interest as well:
- Last mile hazards (examples: click-to-cart, drone, grocery delivery to home)
- Unit load stability - long-duration horizontal acceleration
- Clamp truck handling
- Measurement of dynamic and non-vertical compression forces
- Stacked vibration (specific example of the topic above)
- Thermal performance of shipping containers
The funding could be used to support the packaging school research curriculum or support independent research initiatives. The selected researchers will provide a final report and their supporting data to the ISTA Educational Foundation (ISTAEF) upon project completion. They will also present their findings at the ISTA Forum and during a poster presentation at the ISTAEF Fundraising Dinner held during the Forum. The funding could also be used to support the recipients' travel expenses to the Forum. The goal is to tie grants to research in the transit packaging area.
How to Submit Proposals
Universities interested in receiving grants from ISTA's Educational Foundation for research focused on designing packaging for transit may submit their proposals using the above ISTAEF proposal portal.
Eligibility: Any U.S.-based undergraduate program with a concentration in packaging, with the capabilities of executing distribution packaging research may submit a proposal. Specifically,
- It is the applicant’s responsibility to confirm their school’s ability to perform the distribution packaging research as proposed. In general, the applicant must have the capabilities to perform the proposed research. This includes having the appropriate curriculum, instructors, oversight, facilities and faculty and student capabilities to perform the distribution packaging research as proposed.
- By submitting a proposal, the school agrees that their research team is willing and able to present results at the ISTA Forum and the ISTAEF Fundraising Dinner during the Forum.
- Schools do not have to be ISTA members to be eligible for grants.
ISTAEF has developed a document describing the research grant process, which can be accessed by clicking here.
Previous Award Recipients
In 2025, the ISTA Educational Foundation awarded three $4,500 undergraduate research grants for the following proposals. The universities presented their findings at the 2025 ISTA Forum held on March 24-26 in Orlando, Florida.
Impact of Relative Humidity on the Thermal Efficiency of Fiber-Based Insulated Shipping Containers
- Mateo Silva, Student, Virginia Tech
- Mayank Sood, Student, Virginia Tech
- Eduardo Molina, Assistant Professor, Virginia Tech
New Vibration Test Sequence for Flexible Mailers
- Hannah Dickson, Student, Clemson University
- Greg Batt, Associate Professor, Clemson University
Measurement and Evaluation of Vibration Levels of Electric Vehicles in Small Parcel Delivery
- Nikki Cavallaro, Student, Rochester Institute of Technology
- John Mercovich, Student, Rochester Institute of Technology
- Kyle Dunno, Department Chair and Associate Professor, Rochester Institute of Technology
In 2024, the ISTA Educational Foundation awarded three $4,500 undergraduate research grants for the following proposals. The universities presented their findings at the 2024 ISTA Forum held on April 22-24 in San Diego, California.
Experimental Measurement and Observation of Horizontal Acceleration During Controlled Events of a Tractor-semitrailer from Multiple Speeds
- Anthony Valastro, Student, Rochester Institute of Technology
- Myranda Baker, Student, Rochester Institute of Technology
- Kyle Dunno, Assistant Professor, Rochester Institute of Technology
Effects of Convective Heat Transfer and Palletization on the Thermal Performance of Insulated Shipping Containers
- Juan Suarez, Student, University of Florida
- Lucas Avery, Student, University of Florida
- William Pelletier, Instructional Associate Professor, University of Florida
Characterizing the Effect of Atmospheric Pressure on Internal Pressure of Dunnage Airbags in Transportation
- Sophia DeCurtis, Student, Clemson University
- Greg Batt, Associate Professor, Clemson University
In 2023, the ISTA Educational Foundation awarded three $4,500 undergraduate research grants for the following proposals. The universities presented their findings at the 2023 ISTA Forum held on May 1-3 in Houston, Texas.
Evaluation of Crowdsourced Logistics Operations During Last Mile Delivery Segments
- Olivia Pettinicchi, Student, Rochester Institute of Technology
- John Mozrall, Student, Rochester Institute of Technology
- Kyle Dunno, Assistant Professor, Rochester Institute of Technology
Mapping of the Grocery Delivery to Home Process and Hazards in a Suburban Environment
- Alonda Johnson, Student, Virginia Tech Packaging Systems and Design
- Zachary Weston, Student, Virginia Tech Packaging Systems and Design
- Jiyu Niu, Student, Virginia Tech Packaging Systems and Design
- Morgan Bright, Student, Virginia Tech Packaging Systems and Design
- Eduardo Molina, Assistant Professor, Virginia Tech Packaging Systems and Design
The Principle of Optimized Cushion Design for Minimizing Product Damage Throughout the Distribution
- Jack Ames Rupert, Student, University of Wisconsin-Stout
- Lynnae Torgerud, Student, University of Wisconsin-Stout
- Xiaojing Liu (Kate), Assistant Professor, University of Wisconsin-Stout, Engineering & Technology