Asia Pacific Packaging Symposium

November 15, 2023 | Jeju Island, South Korea

We are thrilled to present the 7th edition of the 2023 ISTA Asia Pacific Packaging Symposium to be held November 15, in Jeju Island, South Korea at the Jeju Oriental Hotel. The Symposium is hosted by ISTA, Korea Society of Packaging Science and Technology (KOPAST), APN and organized by Korea Conformity Lab (KCL) and ISTA Asia Pacific Division. The Symposium will be held in conjunction with Asia Packaging Network and Annual Conference of Korea Society of Packaging Science and Technology.

This event aims to bring together academic scholars and students, as well as industry experts, to share knowledge, share passion, and raise awareness about packaging-related education and activities. "New Packaging Paradigm meets Digital Transformation" is the theme of this year's symposium! Download full event brochure here.

Register now!


The following is an overview of the ISTA Asia Pacific Packaging Symposium program!

PDF of Program

November 15
09:00 Opening Ceremony

  • Chair: Hansol Doh (Ewha Womans Univ.)  

09:40-10:00 Opening Remark

  • Jongkyoung Kim, Chair, ISTA APD

09:40-10:00 Welcome Remarks

  • AJ Gruber, President & CEO, ISTA
  • Lerpong Jarupan, APN

Halla hall

General session: Focusing on Global Issues and Trends (ISTA & APN)
Halla hall | Chair: Hansol Doh (Ewha Womans Univ.)


Keynote 1: Recent Research Trends in Packaging

  • Matthew Daum, Michigan State University

Ph.D., Packaging Engineering, Accomplished Fortune 50 executive manager and tenured Big Ten academic School leader. I am known for developing strategy, driving results through collaboration and partnership, and creating inclusive cultures. As Director for Michigan State University's School of Packaging, I have partnered with Advancement to raise $14M+ in 8 months and completed a major building renovation. As an executive level manager at HP Inc., I successfully led global teams in Marketing, R&D,Packaging, Supply Chain and Big Data Analytics for multi-billion dollar businesses.


Keynote 2: Research Highlight on Packaging for Sustainability and Environmentally

  • Lerpong Jarupan, Kasetsart University

11:00-11 :30

Keynote 3: An Odyssey into Multifunctional Biopolymer Fils for Active/Intelligent Food Packaging Applications

  • Jong-Whan Rhim, Kyung Hee University
  • 1 Ph.D. in Food Engineering, Dept. of Food Science, North Carolina State University, Raleigh, NC, USA, 1988
  • M.Sc. in Food Engineering, Dept. of Biological Engineering, Korea Advanced Institute of Science and Technology, Seoul, Korea, 1980
  • B.Sc. in Food Engineering, Dept. of Food Engineering, Yon Sei University, Seoul, Korea, 1977

11:30-13:00 Lunch  

Halla hall
Session 1-1: Distribution Package Testing and Evaluation
Organized by: ISTA Asia Pacific; Chair: Dr. Seungil Yoon (Samsung Bioepis)

13:00-13:30 | Halla hall
Improve Your Packaging with Research & Testing

  • Eric Hiser, ISTA- International Safe Transit Association  
  • Mr. Hiser is Vice President of Standards and Certification at the International Safe Transit Association (ISTA), an association focused on empowering organizations and their people to minimize product damage throughout distribution and optimize resource usage through effective package design.

13:30-14:00 | Halla hall
Latest Innovations for Measuring and Testing Real-World Distribution Conditions

  • Alberto Tellechea Zugarramurdi, Safe Load Testing Technologies
  • Industrial Engineering degree from ETSII - Polytechnic University of Valencia and a master's in business management from the School of Industrial Organization in Madrid.
  • Member of the European and Global Board of Directors at ISTA
  • Corporate Member of the IAPRI Association

14:00-14:30 | Halla hall
How to Optimize the Packaging Design with the Transportation Test Results

  • David Jin, Data Physics, Lansmont
  • PPT Group (Lansmont, Mecmesin, Alluris, James Heal) APAC Regional Director, Chief Representative of Lansmont Corporation China Office. Aerospace industry background, over 28 years' experience in the field of environmental and reliability testing (Mainly shock and vibration) and joint to packaging industries in year 2000, joint Lansmont Corporation in 2007. ISTA member, ex-lSTA Global Technical board member (4 years), Ex-lSTA China Console Member (8 years); member of IAPRI -Packaging for Suitability Work group. Have been studying and supporting ISTA test protocols, Lansmont "Field-to-Lab" methodology and applications for 23 years.

14:30-15:00 | Halla hall
ISTA's Community Focusing on Education, Certification & Member Expertise

  • Matt Thompson, ISTA- International Safe Transit Association
  • ISTA (the International Safe Transit Association) continues to invest in education, certification & sharing of event presentations for its members. Matt will provide an update on ISTA's Packaging Dynamics Professional (ISTA PDP) Certification program just launched over 1 year ago and review how to maintain and extend certification. Matt will highlight new educational content focusing on: (1) Distribution Environment Data Collection &Analysis; (2) Principles of Cold Chain Packaging; (3) an update to ISTA's Responsible Packaging by Design (RPbD) guide and (4) provide a special preview of exclusive new training material featuring ISTA's 6 most popular test procedures using ISTA's brand new virtual distribution packaging test lab.

Sara hall
Session 2-1: Packaging Material Studies
Organized by: Yonsei University; Chair: Prof. Seonghyuk Ko (Younsei Univ.)

13:00-13:30 | Sara hall

The Influence of Particle Arrangement in Nano-coating Layer on Barrier Property for bio-based plastics

  • Prof. Thitiporn Kaewpetch, Kasetsart University

13:30-14:00 | Sara hall

Utilization of Nanoparticles to Improve the Properties of Biodegradable Polymers for Packaging Application

  • Prof. Nattinee Bumbudsanpharoke, Kasetsart University

14:00-14:30 | Sara hall  

Simulations on Particle Dynamics in Film Coating Processes of Particulate Suspensions

  • Hyun Wook Jung, Korea University, Department of Chemical and Biological Engineering
  • 1999, PhD, Department of Chemical Engineering, Korea University
  • 2000- 2001, Postdoc, University of Minnesota
  • 2003-Present, Professor, Department of Chemical and Biological Engineering, Korea University

14:30-15:00 | Sara hall

Exploring the Applications of Lignin Nanoparticles Derived from Industrial Waste for Diverse Packaging Solutions

  • Vanee Chonhenchob, Kasetsart University

15:00-15:20 Coffee Break

Halla hall
Session 1-2: Circular Economy and Packaging
Organized by: ISTA Asia Pacific; Chair: Prof. Hyunmo Jung, Kyongbuk College of Science

15:20-15:50 | Halla hall
The Need to Change the Design Element Conditions of Transport Packaging Containers

  • Hyungbin Kim, Research Center, Korea Association of Industrial Packaging  
  • lnha University
  • Vice president, Korea Association of Industrial Packaging
  • Director, Research center,
  • Korea Association of Industrial Packaging

15:50-16:20 | Halla hall
Circular Economy and PaaS Demonstrated by Reusable Transport Packaging for Large Household Appliances (On-line)

  • Massimo De Santis, Mae Fah Luang University
  • Massimo has matured relevant business experiences in managing significant budgets and operational key responsibilities in the European aerospace industry. A wide experience in managing global projects in the White Goods market sector allowed him to reach several awards. He is an influential pioneer in the development of the field of sustainability, supporting the shift from Linear Economy to Circular Economy and New Plastic Economy through the implementation of a new busines model based on PaaS with the rent of an innovative Reusable and Returnable Protective Packaging with relevant Reverse Logistics in the White Goods global market.

16:20-16:50 | Halla hall
A Case Analysis of Reusable Packaging Life Cycle Assessment for Sustainable E-commerce Packaging Design and Operation (On-line)

  • Jonghoon Park, Toronto Metropolitan University
  • Director of Sustainable Packaging Research Lab
  • The Creative School/ Environmental Applied Science and Management
  • Toronto Metropolitan University, Toronto, Ontario, Canada

16:50-17:20 | Halla hall
Implementation of Artificial Neural Networks and Challenges in Estimating Box Compression Strength (On-line)

  • Euihark Lee, Michigan State University
  • 2019-current: Assistant Professor, Michigan State University
  • 2015-2019: Assistant Professor, Rutgers University
  • 2012-2015: Postdoctoral Research Associate, Rutgers University

Sara hall
Session 2-2: Sustainable Packaging and LCA Studies
Organized by Yonsei University; Chair: Dr. Dongho Kang, KITECH

15:20-15:50 | Sara hall  

Embracing Digital Life Cycle Assessment in Packaging: A Path to Sustainable Development Goals (On-line)

  • Prof. Rafael Aurus, Michigan State Unviversity

15:50-16:20 | Sara hall

Eco-friendly Packaging Materials from Agricultural Wastes in Thailand (especially for Making Molded-Pulp Trays)  

  • Dr. Wirongrong Tongdeesoontorn, Mae Fah Luang University

16:20-16:50 | Sara hall

Enhancing Functional Properties of Novel Biodegradable Packaging to Reduce Food Loss for Sustainability in Modern Society

  • Prof. Nathdanai Harnkarnsujarit, Kasetsart University

16:50-17:20 | Sara hall

Life Cycle Assessment of Eco-Friendly Paper Pouches vs. Vacuum Metallized Film Pouches for Sustainable Food Packaging

  • DONGHOKANG, Korea Institute of Industrial Technology
  • 2015. 07., PhD in School of Packaging, Michigan State University
  • 2014. 07., MSc in Applied Statistics, Michigan State University
  • 2009. 07., MSc in School of Packaging, Michigan State University

18:00-20:00  Dinner and networking (by ISTA)

Become a Sponsor

Become a sponsor of the 2023 ISTA Asia Pacific Packaging Symposium to support our mission of expanding knowledge exchange and promoting packaging excellence. Your support will allow us to expand our outreach efforts by covering the costs of student participation and facilitating the presence of internationally renowned scholars. Your participation as a sponsor will not only increase the symposium's impact but will also align your esteemed brand with our values and aspirations. Together, we can create an invaluable platform for learning, collaboration, and progress within the dynamic world of packaging. Contact Lisa Bonsignore at to request more information.

Sponsor rates: Levels starting at $3,000 USD

Exclusive Benefits: Sponsors will receive the exclusive Symposium experience with 3 VIP tickets, along with advertising placement in the program book.

Request information

Rates & registration

Early Bird Registration rate (ends on October 31): $400 USD

Registration includes the Asia Packaging Network and Annual Conference of Korea Society of Packaging Science and Technology in addition to the ISTA Asia Pacific Packaging Symposium.

One Day Registration rate: $300 USD

Registration rate (after October 31): $500 USD

Register now!


We are pleased to be hosting the 2023 ISTA Asia Pacific Packaging Symposium at the Jeju Oriental Hotel in Jeju, South Korea. The Jeju Oriental Hotel is a 5-star hotel located near the beach of Topdong and only 8 minutes away from the Jeju International Airport.


JK Kim, Principal Researcher of KCL Chair of ISTA Asia-Pacific Division or 010-9397-5344 (mobile)