TempPack 2020



YOU'RE INVITED!

We are pleased to present ISTA's TempPack event, to be held March 16-19 at Disneys Yacht and Beach Club Resorts in Orlando, Florida. This event is co-located with TransPack. TempPack brings together professionals to focus on technical topics related to global temperature controlled performance packaging. The program creates an opportunity for presenters to share their insights, challenges, case studies and research having a direct impact on the industry.

The TempPack program is designed to allow attendees the opportunity to meet other professionals during shared networking and exhibition events of the co-located TransPack event. Join us and prepare to learn, network and become inspired. The ISTA Forum registration rate includes participation in both TransPack and TempPack sessions.

Pre-Forum Training: Certified Packaging Laboratory (CPLP) and Responsible Packaging by Design (RPbD) Training and Certification will be offered prior to the ISTA Forum on March 15th and 16th.


ADVANCING THE PACKAGING COMMUNITY THROUGH COLLABORATION

Check out pictures from the most recent TransPack and TempPack events held May 13-16, 2019 at the Gaylord Rockies Resort Convention Center in Denver, Colorado: Click here!

Companies and organizations that have attended TransPack and TempPack in the past include: Click here!


CALL FOR SPEAKERS

Speaking at TempPack provides numerous benefits for you, your projects and your company including exposure and credibility as an industry forerunner.

Attendees join us to step back from their day-to-day to think about big ideas and what's next in their world. As a speaker, you have the potential to catalyze great ideas on the latest industry research, innovations and trends. Submit an abstract today for consideration and share your passion, grow your professional development and be recognized as an industry expert! If selected to be a program speaker, your attendee registration will be waived. 
 
If you are interested in speaking at TempPack and have an informative topic or case study, we'd like to hear from you. To submit an abstract, choose the submit button below. Deadline: November 11th.

ISTA is interested in topics related to but not necessarily limited to the following for the TempPack program:
- Case Studies on gathering Temperature Lane Data.
- New Methods for Protecting High Value Product in the Supply Chain.
- Unique Algorithms that Simplify Supply Chain Decision Making.
- Unique Design and Distribution Challenges Posed from Large Molecule Protein Solutions.
- Use of the Internet of Things (IoT) for Gathering or Acting on Temperature Data Within a Supply Chain.
- Simulation Applications as a Tool for Reducing Laboratory Studies.
- Innovative Cold Chain Packaging Solutions.

CLICK HERE to submit an abstract.


INTERESTED IN SPONSORSHIP?

Becoming a sponsor provides your company with a unique opportunity to connect with our community as an industry leader. View valuable sponsorship opportunities and contact Lisa Bonsignore for more information.

Who sponsored in 2019? click here