TransPack 2020


YOU'RE INVITED!

We are pleased to present ISTA's TransPack event, to be held March 16-19 at Disneys Yacht and Beach Club Resorts in Orlando, Florida. This event is co-located with TempPack. TransPack provides a balance of valuable presentations, case studies, research and solutions from world-leading experts surrounding the optimization of packaging for transport.  

The TransPack program is designed to allow attendees the opportunity to meet other professionals during shared networking and exhibition events of the co-located TransPack event. Join us and prepare to learn, network and become inspired. The ISTA Forum registration rate includes participation in both TransPack and TempPack sessions.

Pre-Forum Training: Certified Packaging Laboratory (CPLP) and Responsible Packaging by Design (RPbD) Training and Certification will be offered prior to the ISTA Forum on March 15th and 16th.


ADVANCING THE PACKAGING COMMUNITY THROUGH COLLABORATION

Check out pictures from the most recent TransPack and TempPack events held May 13-16, 2019 at the Gaylord Rockies Resort Convention Center in Denver, Colorado: Click here!

Companies and organizations that have attended TransPack and TempPack in the past include: Click here!



CALL FOR SPEAKERS

Speaking at TransPack provides numerous benefits for you, your projects and your company including exposure and credibility as an industry forerunner.

Attendees join us to step back from their day-to-day to think about big ideas and what's next in their world. As a speaker, you have the potential to catalyze great ideas on the latest industry research, innovations and trends. Submit an abstract today for consideration and share your passion, grow your professional development and be recognized as an industry expert! If selected to be a program speaker, your attendee registration will be waived. 
 
If you are interested in speaking at TransPack and have an informative topic or case study, we'd like to hear from you. To submit an abstract, choose the submit link below. Deadline: November 11th.

ISTA is interested in topics related to but not necessarily limited to the following for the TransPack program:
- Packaging Performance Testing Applications and Research.
- Challenges of Protective Package Design.
- Quality Assurance and Validation Best Practices.
- Damage Reduction Success Stories.
- e-Commerce Packaging.
- Sustainable Packaging Development.
- Optimization of Packaging Systems Case Studies.

CLICK HERE to submit an abstract.


INTERESTED IN SPONSORSHIP?

Becoming a sponsor provides your company with a unique opportunity to connect with our community as an industry leader. View valuable sponsorship opportunities and contact Lisa Bonsignore for more information.

Who sponsored in 2019? click here